Silicon Nitride Tube, Si3N4

Datasheet

· Color: Black
· Density: 3.21 g/cm3
· Flexural Strength: 800 MPa
· Fracture Toughness: 6.5 MPam 1/2
· Thermal Stress Parameters: 569 K

 

Silicon Nitride Tube Description

Silicon nitride tube is made of a high-melting-point ceramic material that is extremely hard and relatively chemically inert. Si3N4 is a man-made compound synthesized through several different chemical reaction methods. Due to its even performance at high temperatures, Si3N4 is a commonly used ceramic material in the metallurgical industry. It has excellent thermal shock resistance due to the microstructure. The creep and oxidation resistance of Si3N4 is also superior, its low thermal conductivity and high wear resistance also make it an outstanding material that can withstand conditions of most industrial applications.

There are 5 different methods to produce silicon nitride Si3N4 ceramic, including SRBSN, GPSN, HPSN, HIP-SN, and RBSN, making the application and working material different slightly. In these 5 methods of production, GPSN is most commonly used to produce Si3N4 components. Supreme Ceramic Materials (SCM) can customize Si3N4 tubes for customers accurately.

 

Silicon Nitride Tube Specifications

GPSN

Property

Color

Grey

Mechanical Properties

Density

3.21 g/cm3

Compressive Strength

3000 MPa

Flexural Strength

800 MPa

Weibull-Modulus m

15

Fracture Toughness KIc

6.5 MPa m^1/2

Young's Modulus E

320 GPa

Poisson Ratio

0.28

Hardness Vickers (HV 1)

16 GPa

Thermal Properties

Maximum Temperature (Inert Gas)

1200°C

Maximum Temperature (Air)

1100°C

Thermal Conductivity @ 20°C

28 W/mK

Thermal Conductivity @ 1000°C

16 W/mK

Thermal Expansion (20–100°C)

2*10-6/K

Thermal Expansion (20–1000°C)

3.510-6/K

Thermal Shock parameter R1

600 K

Thermal Shock parameter R2

15 W/mm

Electrical Properties

Resistivity at 20°C

10^12 Ωcm

Resistivity at 800°C

10^7 Ωcm

Dielectric constant

6 MHz

 

Silicon Nitride Tube Applications

Silicon nitride tube is ideal for applications with high dynamic stresses, thermal rigor, and demanding reliability requirements.

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